特长
Features
体积小重量轻 
Miniature and light weight.
适应再流焊与波峰焊
 Suit for reflow and wave flow solder.
电性能稳定可靠性高
 Stable electrical capability, high reliability.
装配成本低并与自动
 Low assembly cost, suit for automatic SMT
装贴设备匹配 
equipment.
机械强度高高频特性优越 
Superior mechanical and frequency characteristics.
符合ROHS指令要求